[Gta04-owner] GTA04 production

Glenn glenn.mh.dk at gmail.com
Wed Jul 25 11:50:31 CEST 2012


On 25/07/12 11.14, Dr. H. Nikolaus Schaller wrote:
> Just a short note: we are coming close to a full understanding
> of the issues.
>
> We have now three independent 3rd-party hints that the DM3730CBP
> BGA chip might get warpage during soldering. Not the same for
> all chips but only some. So using a standard BGA soldering process
> that works perfectly for many other BGAs may randomly fail with these
> short circuits, giving a very suboptimal yield, wasting a lot of money...
>
> This warpage appears to depend on the reflow temperature profile
> and atmosphere. I.e. it is quite tricky and experimental to get close to
> 100% yield.
>
> But if you eventually know what the root cause is, it is easier
> to develop a really good solution.
>
> So I am now confident that we will master this soon.
>
> Nikolaus
>
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>    


Jubii ;-)

-

Is it possible to test the warpage during a pre-heating PCB-less step in 
a nitrogen-atmosphere to disclose chip-packages - especially if they 
warp more than TI specifications?

Glenn



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